In a smaller blog post, Xiaomi discussed the difficulties of developing foldable devices.
Xiaomi recently published an article Entrance, He tried to explain how many obstacles he solved when dealing with the cooling system of the foldable phone. According to the manufacturer, a big problem is that the size of the heat dissipation surface changes when it is closed and open, and the side where the system chip is located will always be hotter.
This is why the Mi Mix Fold uses a butterfly mechanism, which can transfer heat from one side to the other through a hinge. As a result, the cooling surface is now much larger.
The special system of Mi Mix Fold also uses liquid cooling, heating gel, multilayer graphite flakes and copper foil. The hinge serves as a heat transfer channel between the two sides with anti-bending graphite. After 200,000 folds, the material only loses 3-5% of its thermal conductivity. All of these are the result of complex manufacturing processes.
Mi Mix Fold is already on the market in China, but the price of the basic model in China is as high as US$1,500, so when it comes to Europe, its price may exceed US$2,000 (considering the pricing habits of China and Europe).